Combined receptacle and buffer



Aug. 7, 1928. 1,679,603

' F. J. CLEMENGER COMBINED RECEPTACLE Am) BUFFER Filed March 9, 1926 I INVENTOR 5 00c Jarmfiim ye/wa er BY z 2 a P ATTSRNEY Patented Aug. 7, 1928.

UNITED STATES PATENT-OFFICE.

FRANCIS JONATHAN CLEMENGER, OF NEW YORK, N. Y.

COMBINED ncEr'rAoLE AND BUFFER.

Application filed March 9, 1926. Serial No. 93,483.

' of powder, is kept in a separate receptacle.

The buffer and separate receptacle do not lend themselves readily to the ultimate purpose. One or the other may be misplaced and in any event two separate articles must be handled to complete the operation.- It

has been suggested heretofore to provide a combined buffer and receptacle, the bot-tom of the receptacle being perforated to permit the polishing powder to pass through the bufling material overlying the bottom sur face. This device does not operate satisfactorily because the bufiing material is quickly clogged with the polishing powder which then cannot be sifted from the receptacle. I i

. It is the object of the present invention to provide a simple and effective device adapted to act as a receptacle for the polish and to permit the latter to be applied as desired, the receptacle being also provided with a bufling surface to facilitate the polishing op. eration. I

In carrying out the invention the receptacle may be made of any of the metals orof various other materials adapted for such use. It may be of any desired shape.

Preferably it comprises an elongated bodyconsisting of upper and lower parts connected by a tightly fitting slip joint and forming a chamber for the polish. The upper part may have a dome forming a convenient handle. It may be provided with perforations through which the polish may be sifted. Such perforations may be closed normally by a suitable solid cover.

The butting material which may be of chamois skin, g cloth, is secured to the bottom of the lower part of the receptacle in any suitable manner as by the application of an adhesive SLlCll'f as glue thereto or 1t may be held by a slip ring of metal adapted to engage and hold the edges of the material. A cover of metal or other material may be provided to slip over the butting surface and thus to protect it from soiling. The cover may be held in oat skin or closely wovenv place by a friction fit or suitable spring" clipsmay be provided at the ends thereof.

The device as describedaifords a useful and convenient receptacle for the polish and it facilitates the application and use thereof by-providing a bufiing surface which, being attached to the receptacle, is ready for iiistant use. The polishing material and bufting surface cannot be separately misplaced. 'lheperforations in the upper part of the receptacle permit sifting of the polish.

These perforations are not easily clogged and the device cannot thus become inoperative. a

The invention will be further described with reference to the accompanying draw- I Fig. 3 is a view in perspective showing" the cover for the builing surface removed.

Referring to the drawing,5 and 6 indi- I cate the upper and lowersegments of'the Jreceptacle'which are conneetedby a tightly fitting slip joint 7 forming a chamber 8 for the polish. A dome 10 on the i upper segment 5 provides a handle for the device. A plurality, of openingsll in the top of the dome permit sifting of the polish from the receptacle. The openings maybe closed by a cover 12. j

The bufiingmaterial 13 covers the bottom of the lower segment (land is held in place by a slip ring 14.. The buffing material may be secured by an adhesive substance such as glue to the bottom of the lower segment if desired.

the cover 1.2 may be returned to closed osition to prevent escape of the polish an the cover 15 may be replaced.

Various changes may be made in the form 1 and arrangement of the parts as well as in the nature of the materials of which the device is constructed without departing from the invention or sacrificing any of its advantages.

I claim 1. A combined receptacle and buffer ,adapted to facilitate the application of polish to finger-nails comprising a body forming 'the receptacle and carrying the bufiing material, the body port'on having perforations above the buffing material through which the polish can be sifted and a cover for the perforations.

2. A combined receptacle and buffer adapted to facilitate the application of polish to finger-nails comprising a body forming the receptacle and carrying the buffing material, a separable cover for the buffing material, the body portion having perforations above the bufling material through which the polish can be sifted and a cover for the perforations.

3. A combined receptacle and buffer adapted to facilitate the application of polish to finger-nails comprising a body formed of upper and lower segments connected by a closely fitting joint, buffing material on the bottom of the lower segment, the upper segment having perforations through which the polish can be sifted and a cover for the perforations. V

4. A combined receptacle and buffer adapted to facilitate the application of polish to finger-nails comprising a body formed of upper and lower segments connected by a closely fitting joint, bufiing material on the bottom of the lower segment, a separable cover for the builing material, the upper segment having perforations through which the polish can be sifted and a cover for the perforations.

5. A combined receptacle and buffer adapted to facilitate the application of polish to finger-nails comprising a body formed of upper and lower segments connected by a closely fitting joint, butting material on the bottom of the lower segment, a slip-ring securing the buffing material in place, the' which the polish can be sifted and a coverfor the perforations.

7. A combined receptacle and buffer adapted to facilitate the application of polish to finger-nails comprising a body formed of upper and lower segments connected by a closely fitting joint, bufiing material on the bottom of the lower segment, a dome on the upper segment forming a handle and having perforations through which the polish can be sifted and a cover for the perforations.

8. A combined receptacle and buffer adapted to facilitate the application of polish to finger nails comprising a body formed of upper and lower segments connected by a closely fitting joint, bufling material on the bottom of the lower segment, a separable cover for the buffing material, a dome on the upper segment forming a handle and having perforations through which the polish can be sifted and a cover for the perforations.

Signed at New York city, in the countyo'f New York, State of New York, on this the 6th day of March, in the year 1926 A. D.

FRANCIS JONATHAN CLEMENGER. 

